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ruSolut USB-SD-NAND Data Recovery & Repair Forensics

Course Content

DAY 1
Module 1: FLASH MEMORY USAGE OVERVIEW
• Overview
• Diversity of devices
• Structure, components and functionality
• Standard and monolithic devices
• Controller and Flash memory functions
• Pros and cons of flash memory
• Data recovery workflow
• LAB: Overview of different flash storage devices and flash memory localization
Module 2: NAND FLASH MEMORY
• Raw NAND vs managed NAND
• Flash memory chip types
• Flash memory packages
• LAB: Overview of flash memory packages
• NAND interface
• Internal structure
• Crystals, Planes, Blocks, Pages
• Data allocation within memory
• Multi/Single page allocation
• NAND parameters
• Direct memory access mode
• Bit errors in NAND memory
• Voltage tuning for better reading
• Physical image extraction
• LAB: Direct access to NAND and Physical image extraction to file
Module 3: PHYSICAL IMAGE OF NAND MEMORY
• Internal structure
• Blocks, Pages, Data, Spare and ECC areas
• Page layout
• Spare area structure
DAY 2
Module 4: FLASH CONTROLLERS
• Data flow from input to NAND
• Reverse operations
• Error Correction Codes
• Data optimization in channel
• Page allocation
• Block management, wear leveling and translation (FTL)
• LAB: ECC detection on 2-3 cases
Module 5: VISUAL NAND RECONSTRUCTOR
• Software overview
• Databases, settings and components
• Workspace overview
• Elements, Parameters, Toolbars and functions
• Dump viewers
• Hex, Bitmap, Structure viewers
• Bitmap concept
• Work in Bitmap and Structure viewer
• LAB: Page structure analysis on 2-4 dumps
Module 6: PHYSICAL IMAGE ANALYSIS BASED ON
PATTERNS
• Page layout analysis
• Data, Spare and ECC area patterns
• Inverted data patterns
• LAB: Analysis of inversion on 1-2 cases
• Scrambled/Non-scrambled data patterns
• LAB: Analysis of scrambler and XOR key on 2-3 cases
• Page allocation patterns
• LAB: Page allocation analysis on 2-3 cases
Module 7: BLOCK TRANSLATION ALGORITHM
• Concept of block management and translation
• Block size determination
• Spare area pattern analysis
• Logical Block Number parameters
• Header parameters
• Translator creation in software
• Missing and duplicated blocks
• Data cache
• Logical image creation
• LAB: Logical image reconstruction on 1-3 cases

DAY 3
Module 8: LOGICAL IMAGE RECONSTRUCTION
PROCESS
• Three phases of the data recovery process
• Physical images
• Virtual images
• Logical image
• Translator adjustment
• Analysis of conflicts within block sequence
• LAB: Complete data recovery process
Module 9: PRACTICAL DATA RECOVERY ON DUMPS
• LAB: Low complexity 2-3 cases
• LAB: Medium complexity 2-3 cases
• LAB: High complexity 1-2 cases
DAY 4
Module 10: REVERSE ENGINEERING OF UNSUPPORTED DEVICES. ECC CODES
• ECC (BCH) code analysis and reverse engineering
• Code structure
• Codewords, Payload, Parity
• Polynomials, tweaks
• BCH brute force
• LAB: Reverse engineering of ECC code on 2-3 dumps
Module 11: REVERSE ENGINEERING OF UNSUPPORTED DEVICES. SCRAMBLING (XOR) KEYS
• XOR key patterns
• Search of XOR key
• XOR key extraction
• XOR key cleaning
• XOR key check and application
• LAB: XOR key extraction from dump on 1-2 cases
Module 12: REVERSE ENGINEERING OF UNSUPPORTED
DEVICES. NAND MEMORY CONFIG ANALYSIS
• NAND protocol parameters
• Physical parameters: crystals, planes, blocks, pages
• Async vs WL protocols
• Reverse engineering of all parameters
• Configuration test
• LAB: NAND memory config analysis on 1 case
DAY 5
Module 13: PRACTICE ON NON-STANDARD AND
COMPLICATED CASES
• Bad columns
• Analysis and removal
• LAB: Data recovery with bad columns on 1 case
• Multiple chips
• LAB: Data recovery from multiple dumps on 1-2 cases
Module 14: EMMC CHIPS
• Overview
• eMMC application in multimedia devices
• Logical image extraction
• Smartphones, tablets
• Operating systems, file systems
• Data categories
• VNR capabilities
• Android data extractor
• Data extraction vs Data carving
• Carvers for deleted data recovery
• LAB: Data carving from Android dump
Module 15: EMMC CHIPS. NAND ACCESS
• New technology overview
• eMMC-NAND access for un-erased data extraction
• eMMC-NAND access on faulty chip
• LAB: Data recovery from eMMC-NAND dump

Details

Duration - 5 Days

Dates & Locations

  • 23.05.22 - Canberra

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